cirke Posted October 26, 2012 Share #1 Posted October 26, 2012 (edited) Advertisement (gone after registration) Leica FF CIS will be fabricated by CMOSIS’ foundry partner STMicroelectronics. STMicroelectronics’ IMG175 300 mm Cu process, developed for 1.75 µm mobile CIS, will be adapted to 6 µm pixels and use 0.11 µm design rules for the front end of line (FEOL) processing and 90 nm design rules for the BEOL. While Leica has nowhere near the market share of Japanese FF camera companies, the transition to sub 0.18 µm device production is an event that could possibly alter the product roadmaps and strategies of several companies. chipworks.com :-) Edited October 26, 2012 by erick 1 Link to post Share on other sites More sharing options...
Advertisement Posted October 26, 2012 Posted October 26, 2012 Hi cirke, Take a look here The new MAX 24 MP sensor. I'm sure you'll find what you were looking for!
jaapv Posted October 26, 2012 Share #2 Posted October 26, 2012 (edited) Interesting to find Leica at the cutting edge of sensor technology . Edited October 26, 2012 by jaapv Link to post Share on other sites More sharing options...
cirke Posted October 26, 2012 Author Share #3 Posted October 26, 2012 yes it was the weak point , but now with the new M and Leica lenses Link to post Share on other sites More sharing options...
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